The TiMo module conforms to JSTD-020D1 standards for reflow temperatures. In view of the high heat capacity and poor wetting of the product during the reflow soldering process, this paper optimizes the temperature curve prediction. A thermal profile can be ranked on how it fits in a process. The thermal profile is often measured along a variety of dimensions such as slope, soak, time above liquidus (TAL), and peak. It is ultimately the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during reflow meet the requirements of the solder paste. A thermal profile is a complex set of time-temperature data typically associated with the measurement of thermal temperatures in an oven (ex: reflow oven ). Generally, it is recommended to add 20-40C to the melting point of the.
#REFLOW OVEN TEMPERATURE SERIES#
TiMo is a surface mounted device (SMD) designed to be easily integrated into high-volume production lines including reflow soldering to a PCB. The soldering peak temperature varies with all solder pastes in the reflow section. In a typical solder reflow oven, the PCB enters one end of the oven and moves at a constant speed through a series of temperature controlled zones (See Figure 1).
Reflow Soldering TiMo reflow soldering specification ¶
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